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Multilayer PCB Assembly

Multilayer PCB Assembly
Multilayer PCB Assembly
Product Code : PCBA 03
Product Description

We are identified as one of the leading organizations, engaged in manufacturing and supplying Multilayer PCB Assembly. This assembly has at least three layers of conductive material, buried in the center of the material. Best quality materials and components are used to produce the board. All the layers are placed into a lamination press, then extremely high temperature and pressure are applied to the stackup. Multilayer PCB Assembly is used in computers, medical equipment, telecom equipment and more.


  • Shielding through careful placement of power and ground layers for PCB
  • Easier incorporation controlled impedance features
  • Our assembly reduces the need for interconnection wiring harnesses
  • The PCB has smaller size, considerable savings on space and reduces overall weight
  • It is used in hand held devices, test equipment, cell phone, signal transmission and more
  • Greatly reduces the errors of routing & assembly and increases the degree of automation